Sun and Texas Instruments (TI) will collaborate on optimized end-to-end
wireless solutions for 2.5G and 3G networks. TI will also license Sun's
Connected Limited Device Configuration HotSpot Implementation (CLDC HI)
for integration into the TI family of TCS chipsets for GPRS, EDGE, CDMA
and UMTS-enabled handsets and wireless OMAP applications processors.
Integrating CLDC HI into the chipsets will reduce the complexity of
JavaTM technology-enabled handset production and ensure an enhanced
consumer experience. OEMs, wireless operators and applications
developers will also benefit from revenue-generating opportunities from
the initiative. Another benefit will be to reduce the cost and complexity
of deploying mobile data services for mobile device manufacturers and
wireless operators.
Sun and TI also are working together to provide an optimized
implementation of Mobile Information Device Profile 2.0 (MIDP 2.0) on
TI's TCS wireless chipsets and OMAP processors.
Sun and TI plan to validate the optimized Java technology
implementation on the OMAP platform with Sun's Content Delivery Server
to reduce the complexity for mobile operators in the deployment of Java
technology-based mobile data services.
"Widespread deployment of compelling new applications based on open
standards-based platforms will drive consumer demand for 2.5G and 3G
wireless handsets and services," said Rick Kornfeld, vice president and
general manager of TI's Wireless Chipset Business Unit. "We are pleased
to work with Sun to accelerate the growth of the wireless market via
complete, end-to-end Java solutions and optimized Java technology for
TI's TCS wireless chipsets and OMAP applications processors."
"Mobile device manufacturers and wireless operators recognize Java
(technology) as a leading technology that delivers value in the
development and deployment of mobile data services," said Alan Brenner,
vice president of Sun's Consumer and Mobile Systems Group. "Together,
Sun and TI will provide new revenue-generating opportunities for OEMs,
wireless operators and developers by enabling a broad range of Java
applications and content to accelerate the deployment of Java
technology-enabled handsets and services. Beyond this collaboration, we
plan to work with TI on future projects that will enable more exciting
Java content across different handset markets."
Implementations and designs from the initiative are expected to be
available from Sun and TI by the second quarter of 2004.
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