System News
Sun and TI Initiative to Offer 2.5G and 3G Solutions
Reduce Complexity and Enhance User Experience
November 3, 2003,
Volume 69, Issue 1

Sun and Texas Instruments (TI) will collaborate on optimized end-to-end wireless solutions for 2.5G and 3G networks. TI will also license Sun's Connected Limited Device Configuration HotSpot Implementation (CLDC HI) for integration into the TI family of TCS chipsets for GPRS, EDGE, CDMA and UMTS-enabled handsets and wireless OMAP applications processors.

Integrating CLDC HI into the chipsets will reduce the complexity of JavaTM technology-enabled handset production and ensure an enhanced consumer experience. OEMs, wireless operators and applications developers will also benefit from revenue-generating opportunities from the initiative. Another benefit will be to reduce the cost and complexity of deploying mobile data services for mobile device manufacturers and wireless operators.

Sun and TI also are working together to provide an optimized implementation of Mobile Information Device Profile 2.0 (MIDP 2.0) on TI's TCS wireless chipsets and OMAP processors.

Sun and TI plan to validate the optimized Java technology implementation on the OMAP platform with Sun's Content Delivery Server to reduce the complexity for mobile operators in the deployment of Java technology-based mobile data services.

"Widespread deployment of compelling new applications based on open standards-based platforms will drive consumer demand for 2.5G and 3G wireless handsets and services," said Rick Kornfeld, vice president and general manager of TI's Wireless Chipset Business Unit. "We are pleased to work with Sun to accelerate the growth of the wireless market via complete, end-to-end Java solutions and optimized Java technology for TI's TCS wireless chipsets and OMAP applications processors."

"Mobile device manufacturers and wireless operators recognize Java (technology) as a leading technology that delivers value in the development and deployment of mobile data services," said Alan Brenner, vice president of Sun's Consumer and Mobile Systems Group. "Together, Sun and TI will provide new revenue-generating opportunities for OEMs, wireless operators and developers by enabling a broad range of Java applications and content to accelerate the deployment of Java technology-enabled handsets and services. Beyond this collaboration, we plan to work with TI on future projects that will enable more exciting Java content across different handset markets."

Implementations and designs from the initiative are expected to be available from Sun and TI by the second quarter of 2004. [...read more...]

Keywords:

fullsource
 

Other articles in the News section of Volume 69, Issue 1:

See all archived articles in the News section.



News and Solutions for Users of Solaris, Java and Oracle's Sun hardware products
Just the news you need, none of what you don't – 42,000+ Members – 24,000+ Articles Published since 1998