NetworkComputing May 14, 2012 May 14, 2012,
Volume 171, Issue 3
"As Intel and AMD pack six, eight or more cores into each processor, servers are once again struggling to move data from main memory in and out of those cores fast enough to keep them fully occupied. The Hybrid Memory Cube Consortium, led by Micron, Samsung and Intel, has come up with a memory package that promises higher CPU-to-memory bandwidth by extending integrated circuit technology to the third dimension..."
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Hybrid Memory Cube Takes RAM to the Third Dimension
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