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Sun UltraSPARC T2 Reference Design Kit Released Accelerates Designing, Development, and Testing of UltraSPARC T2 Designs
Sun's UltraSPARC T2 Reference Design Kit (RDK) released this week gives system designers the essential tools necessary to design, test, and verify designs based on this CMT technology. The UltraSPARC T2 processor consists of eight cores with eight threads per core. It is one of the industry's highest energy efficiency per thread. The UltraSPARC T2 incorporates dual 10 Gb Ethernet Network Interface Units (NIUs), eight Stream Processing Units (SPUs) for line rate cryptographic acceleration, and dual PCIe I/O interfaces on the chip. The UltraSPARC T2 RDK includes:
The RDK motherboard includes a host of interconnect options: PCIe I/O slots (3), XAUI slots (2), Gb Ethernet ports (4), USB 2.0 ports (2), and SAS/SATA drive connectors (2). A complete listing of all the available ports is included on the RDK datasheet. "The RDK is an essential tool for network infrastructure designers to accelerate their development and delivery of next generation multicore, multithread platform designs...," said Mike Knudsen, vice president of marketing and business development for Sun's Microelectronics unit. The RDK supports the Solaris 10 Operating System (OS) and will also support Wind River\'s platform for Network Equipment, Carrier Grade Linux (CGL), available in early 2009. Reference documents, Sun experts, and order information are now available from the Sun site. More Information
Sun Microsystems Announces Availability of First CMT Reference Design Kit UltraSPARC T2 Reference Design Kit Sun Microelectronics Support and Reference page
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The RDK is an essential tool for network infrastructure designers 
Sun UltraSPARC T2 Reference Design Kit Released
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