Marc Tremblay on High Performance Throughput Computing at PARC Forum Niagara UltraSPARC T1 Chip
Audio and video links are now available for a presentation by Marc Tremblay, Sun Fellow, Vice President, and Chief Architect, Sun's Scalable Systems Group, on High Performance Throughput Computing that he gave at the Palo Alto Research Center (PARC) earlier this year.
PARC is subsidiary of Xerox Corp. which conducts pioneering interdisciplinary research in the physical, computational and social sciences.
Tremblay's talk is the first in a three-part series that will explore the benefits and challenges of Multicore computing. Tremblay discussed the performance enhancements achieved using Sun's 8 core Niagara computer chip.
The Niagara chip was introduced in November 2005. It is now called the UltraSPARCR T1 chip and it offers a binary-compatible upgrade path for current Sun SPARC users and industry-leading performance and performance per watt compared to alternatives. The UltraSPARC T1 uses the CoolThreadsTM chip mulit-threading technology.
"Throughput Computing, achieved through a new generation of microprocessors composed of multiple multi-threaded cores, can lead to performance improvements that are 10 to 30x those of conventional processors and systems," Tremblay noted, according to the PARC web site. "In this talk I will discuss how the value of a robust, high-performance single thread leads to even higher throughput rates. I will also describe some of the techniques we are implementing in future mainstream processors that accomplish the somewhat conflicting goal of attacking both latency and throughput."
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